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SYSTECH AND MICROLINK TOGETHER UNVEIL MALAYSIA’S NEXT-GENERATION GPUaaS INFRASTRUCTURE
Supermicro GPU Servers Powered by NVIDIA to Accelerate AI Growth Across Enterprises and Government
KUALA LUMPUR, 6 NOVEMBER 2025 – Systech Bhd. (“Systech”), a deep-rooted...
MATTA AND BASE MALAYSIA SIGN MOU TO ELEVATE ADVENTURE TOURISM IN MALAYSIA
KUALA LUMPUR, 3 APRIL 2026 – The Malaysian Association of Tour and Travel Agents (MATTA) today formalised a strategic partnership with BASE Malaysia through...
Global Turbine Asia Strengthens Aerospace Talent Ecosystem Through Three Strategic Signings
Collaborations with UTeM, AMRACE and PT3 to Support Future Talent, Veteran Reskilling and Industry Capability Development
KUALA LUMPUR, 29 JUNE 2026 – Global Turbine Asia...
MSB Global Enters into Strategic MoU to Explore Energy Storage Opportunities in Malaysia
MoU Marks MSB’s Exploration into the Renewable Energy Ecosystem
KUALA LUMPUR, 27 JANUARY 2026 – MSB Global Group Berhad ("MSB Global" or the "Group"), a...
ACCOR AND TROPICANA CORPORATION BERHAD SIGN AGREEMENT FOR MERCURE LIVING GENTING HIGHLANDS
Accor and Tropicana Corporation Berhad have signed a hotel management agreement for Mercure Living Genting Highlands, an extended-stay hospitality development within the Tropicana WindCity...
Genting Malaysia Berhad (GENM) has entered MoU with AGIBOT Innovation (Shanghai) Technology Co. Ltd...
Genting Highlands, Malaysia, 17 April 2026 – Genting Malaysia Berhad (GENM), a Malaysianbased multinational company and a leading player in the leisure and hospitality...
Encorp Berhad Signs Memorandum of Understanding (MOU) with FELDA to undertake the design and...
The MoU signing ceremony, which took place at Menara FELDA, was signed by Dato’ Dr. Suzana Idayu Wati binti Osman, Director-General of FELDA and...
MIDF AND WIPO SIGN LANDMARK MOU TO PILOT IP-BACKED FINANCING FOR MALAYSIAN ENTERPRISES
Malaysian Industrial Development Finance Berhad (MIDF), a subsidiary of MBSB Group, today signed a landmark Memorandum of Understanding (MoU) with the World Intellectual Property...
